The Effect of Additional TiO2 Nanofluid on Heat Transfer Rate and Thermal Resistance on Processor Cooling with Ultrasonic Vibration
DOI: https://doi.org/10.25077/metal.6.2.117-125.2022
Author(s)
Dhiya'ul Ro'id Alfaris (Politeknik Negeri Malang)Sudarmadji Sudarmadji (Politeknik Negeri Malang)
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